等離子刻蝕物的處理Treatment of plasma etchants

等離子刻蝕物的處理

在等離子刻蝕過程中，通過處理氣體的作用，被刻蝕物會變成氣相（例如在使用氟氣對硅刻蝕時）。處理氣體和基體物質被真空泵抽出，表面連續被新鮮的處理氣體覆蓋。不希望被刻蝕部分要使用材料覆蓋起來（例如半導體行業用鉻做覆蓋材料）。

等離子方法也用于刻蝕塑料表面，通過氧氣可以灰化填充混合物，同時得到分布分析情況。刻蝕方法在塑料印刷和粘合時作為預處理手段是十分重要的，如POM、PPS和PTFE。等離子處理可以大大地增加粘合潤濕面積提高粘合強度。

                                                                 Treatment of plasma etchants

      In the plasma etching process, the etched material will change into the gas phase (e.g. when silicon is etched with fluorine gas). The treatment gas and matrix material are pumped out by vacuum pump, and the surface is continuously covered with fresh treatment gas. The parts that are not to be etched should be covered with materials (for example, the semiconductor industry uses chromium as the covering material).

     The plasma method is also used to etch the plastic surface. The mixture can be ashed by oxygen and the distribution analysis can be obtained at the same time. Etching methods, such as POM, PPS and PTFE, are very important as pretreatment methods in plastic printing and bonding. Plasma treatment can greatly increase the bonding wetting area and improve the bonding strength.